Invention Grant
- Patent Title: Antenna device and method for manufacturing antenna device
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Application No.: US15245022Application Date: 2016-08-23
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Publication No.: US10770795B2Publication Date: 2020-09-08
- Inventor: Chuei-Tang Wang , Chung-Hao Tsai , Jeng-Shien Hsieh , Wei-Heng Lin , Kuo-Chung Yee , Chen-Hua Yu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L23/24 ; H01Q9/06 ; H01Q1/22 ; H01Q3/24 ; H01Q1/36 ; H01Q1/48
Abstract:
An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.
Public/Granted literature
- US20170346185A1 ANTENNA DEVICE AND METHOD FOR MANUFACTURING ANTENNA DEVICE Public/Granted day:2017-11-30
Information query
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