Invention Grant
- Patent Title: Compact high speed connector
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Application No.: US16429089Application Date: 2019-06-03
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Publication No.: US10770845B2Publication Date: 2020-09-08
- Inventor: Brandon Janowiak , Kent E. Regnier , Jerry Kachlic
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Main IPC: H01R24/60
- IPC: H01R24/60 ; H01R12/72 ; H01R13/504 ; H01R13/6594 ; H01R13/629 ; H01R13/639 ; H01R13/6582 ; H01R107/00

Abstract:
A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.
Public/Granted literature
- US20200059051A1 COMPACT HIGH SPEED CONNECTOR Public/Granted day:2020-02-20
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