Invention Grant
- Patent Title: High integration assembly process for AC adapter with foldable prongs
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Application No.: US16257925Application Date: 2019-01-25
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Publication No.: US10770854B2Publication Date: 2020-09-08
- Inventor: Andrew Thomas Sultenfuss , Priyank Jatin Gajiwala
- Applicant: Dell Products, L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products, L.P.
- Current Assignee: Dell Products, L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Fogarty LLP
- Main IPC: H01R13/44
- IPC: H01R13/44 ; H01R31/06 ; H01R24/68 ; H01R13/52 ; H05K1/11 ; H01R13/15 ; H01R35/04

Abstract:
Methods of assembly are provided for an AC plug supporting foldable prongs. The AC plug includes: a cover including slots and prongs. In an extended position, the prongs are insertable in AC outlet receptacles and each prong contacts a spring mounted terminal that is coupled to a power circuit. In a retracted position, each prong is recessed in a slot of the cover and does not contact a spring mounted terminal. In the extended position, the coupling between each prong and the power circuit does not utilize wires. A first end of each spring mounted terminal is positioned on a contact pad of a printed circuit board (PCB) that connects the AC plug to the power circuit. A cap is fastened to the cover and secures the spring mounted terminals to the respective contact pads and secures the PCB and spring mounted terminal to the cover.
Public/Granted literature
- US20200244020A1 HIGH INTEGRATION ASSEMBLY PROCESS FOR AC ADAPTER WITH FOLDABLE PRONGS Public/Granted day:2020-07-30
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