Invention Grant
- Patent Title: Headphone device
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Application No.: US16504736Application Date: 2019-07-08
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Publication No.: US10771885B2Publication Date: 2020-09-08
- Inventor: Shinji Kamimura
- Applicant: JVCKENWOOD Corporation
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: JVC KENWOOD CORPORATION
- Current Assignee: JVC KENWOOD CORPORATION
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7082af60
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
A headphone device includes a head pad, a band, and a sleeve. The head pad has a curved shape with a first radius of curvature. The band extends from an edge of the head pad into a curved shape with a second radius of curvature different from the first radius of curvature, and supports a housing, via a hanger, housing a speaker unit. The sleeve has a curved shape with the first radius of curvature and is slidable along the head pad to cover the band so as to change the radius of curvature at a part of the band covered with the sleeve to approximate to the first radius of curvature.
Public/Granted literature
- US20200029145A1 Headphone Device Public/Granted day:2020-01-23
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