Invention Grant
- Patent Title: Low transmission loss copper foil and methods for manufacturing the copper foil
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Application No.: US16715284Application Date: 2019-12-16
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Publication No.: US10772199B2Publication Date: 2020-09-08
- Inventor: Chien-Ming Lai , Yao-Sheng Lai , Jui-Chang Chou
- Applicant: Chang Chun Petrochemical Co., Ltd
- Applicant Address: TW Taipei
- Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee Address: TW Taipei
- Agency: Nixon & Peabody LLP
- Agent Thomas P. Pavelko
- Main IPC: B21C37/00
- IPC: B21C37/00 ; H05K1/09 ; C25D1/04 ; C25D3/38 ; B32B15/01 ; C25D5/10 ; C25D3/12 ; B32B15/20 ; B32B15/08 ; C25D3/22
Abstract:
Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 μm3/μm2. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Public/Granted literature
- US20200253047A1 LOW TRANSMISSION LOSS COPPER FOIL AND METHODS FOR MANUFACTURING THE COPPER FOIL Public/Granted day:2020-08-06
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