- Patent Title: Printed circuit board package and display device including the same
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Application No.: US16151881Application Date: 2018-10-04
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Publication No.: US10772208B2Publication Date: 2020-09-08
- Inventor: Hee Kwon Lee
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si, Gyeonggi-Do
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@35c2a9e7
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G06F3/044 ; G06K9/00 ; H05K1/11 ; H05K1/02

Abstract:
A display device includes a display panel and a printed circuit board (PCB) connected to the display panel. The PCB includes an insulating base. A pressure sensor is disposed to overlap with the display panel. A fingerprint sensor is disposed to overlap with the display panel and is spaced apart, on a first side in a first direction, from the pressure sensor. A first distance from the pressure sensor to a first edge of the insulating base is greater than a second distance from the pressure sensor to a second edge of the insulating base opposite the fingerprint sensor.
Public/Granted literature
- US20190306986A1 PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME Public/Granted day:2019-10-03
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