Invention Grant
- Patent Title: Adhesive substrate and method for separating an object from an adhesive substrate
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Application No.: US16121953Application Date: 2018-09-05
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Publication No.: US10772213B2Publication Date: 2020-09-08
- Inventor: Yuji Irisawa , Toshiaki Hatsumi
- Applicant: Shin-Etsu Polymer Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee: Shin-Etsu Polymer Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@35f05552
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L23/00 ; B32B7/12 ; C09J163/00

Abstract:
An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.
Public/Granted literature
- US20190327838A1 Adhesive Substrate and Method for Separating an Object from an Adhesive Substrate Public/Granted day:2019-10-24
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