Invention Grant
- Patent Title: Thermally configured connector system
-
Application No.: US15876741Application Date: 2018-01-22
-
Publication No.: US10772237B2Publication Date: 2020-09-08
- Inventor: Kent E. Regnier
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Main IPC: H01R13/633
- IPC: H01R13/633 ; H05K7/20 ; G02B6/42

Abstract:
A connector system with improved thermal management is provided. Various receptacles are provided that include features which may enhance air flow, and therefore cooling. Thermal channel features in the receptacle cage and/or housing allow air passing through the receptacle to directly remove thermal energy from components within and carry the thermal energy out of the cage.
Public/Granted literature
- US20180146576A1 THERMALLY CONFIGURED CONNECTOR SYSTEM Public/Granted day:2018-05-24
Information query