Invention Grant
- Patent Title: Component mounting device and component mounting system
-
Application No.: US16310145Application Date: 2016-06-17
-
Publication No.: US10772250B2Publication Date: 2020-09-08
- Inventor: Hiroshi Oike , Hirotake Esaki , Kenji Sugiyama
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2016/068083 WO 20160617
- International Announcement: WO2017/216950 WO 20171221
- Main IPC: H05K13/00
- IPC: H05K13/00 ; H05K13/08 ; H05K13/04 ; G05B19/418

Abstract:
Component mounting system 1 includes electronic component mounting device 10, control device 100, image processing device 110, memory device 115, and display 120. Electronic component mounting device 10 includes mounting head 26, supply device 28, and component camera 90, and is configured to use mounting head 26 to pick up an electronic component supplied by supply device 28 and to image the held electronic component using component camera 90. When saving the captured image data on memory device 115, it is determined whether a condition for using a first format is satisfied (S1, S2). When the conditions for using the first format are satisfied (S2: yes), the captured image data is saved on memory device 115 in the first format that is a lossless compression format (S5). When conditions for using the first format are not satisfied (S2: no), the captured image data is saved on memory device 115 in the second format, which is a lossy compression format.
Public/Granted literature
- US20190335632A1 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING SYSTEM Public/Granted day:2019-10-31
Information query