Invention Grant
- Patent Title: Orthopaedic implant with bonded porous material
-
Application No.: US15949700Application Date: 2018-04-10
-
Publication No.: US10772731B2Publication Date: 2020-09-15
- Inventor: Gregory C. Stalcup , Paul S. Nebosky
- Applicant: SMed-TA/TD, LLC
- Applicant Address: US IN Columbia City
- Assignee: SMed-TA/TD, LLC
- Current Assignee: SMed-TA/TD, LLC
- Current Assignee Address: US IN Columbia City
- Agency: Taylor IP, P.C.
- Main IPC: A61F2/30
- IPC: A61F2/30 ; A61F2/38 ; B29C65/54 ; B29C65/00 ; B29L31/00
Abstract:
An orthopaedic implant includes a main body having a surface with at least one bonding feature, at least one porous material having a plurality of pores, and a bonding material placed in the plurality of pores of the at least one porous material and the at least one bonding feature to form a bond between the at least one porous material and the main body.
Public/Granted literature
- US20180296349A1 ORTHOPAEDIC IMPLANT WITH BONDED POROUS MATERIAL Public/Granted day:2018-10-18
Information query
IPC分类:
