A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.