A resin molding mold in accordance with the present application is a resin molding mold for molding a resin molded product. The resin molding mold includes a molding mold and a mirror-surface coat layer formed on a mold surface of the molding mold. The mirror-surface coat layer is formed by a thermosetting resin having a thermal conductivity in a range from 0.10 W/(mK) or more to 0.99 W/(mK) or less. The thickness of the mirror-surface coat layer is set in a range from 1.0 μm or more to 30 μm or less, and is preferably set to 20 μm or less. The surface of the mirror-surface coat layer is provided with a flat-surface maintaining part formed into a substantially flat surface.