Invention Grant
- Patent Title: Composition for sintering, method for producing silver nanoparticles, circuit board, and method for manufacturing circuit board
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Application No.: US16459925Application Date: 2019-07-02
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Publication No.: US10774231B2Publication Date: 2020-09-15
- Inventor: Hiroto Fukushima , Akihiko Hanya
- Applicant: STANLEY ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: STANLEY ELECTRIC CO., LTD.
- Current Assignee: STANLEY ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7aed08a3
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/14 ; C09D11/52 ; B22F1/00 ; B22F1/02 ; B22F9/16 ; H05K3/12 ; H05K1/02 ; C09D11/037 ; H05K1/18
Abstract:
An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
Public/Granted literature
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