Invention Grant
- Patent Title: Metalization of surfaces
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Application No.: US15336839Application Date: 2016-10-28
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Publication No.: US10774424B2Publication Date: 2020-09-15
- Inventor: Björn Atthoff , Sven Göthe
- Applicant: Cuptronic Technology Ltd.
- Applicant Address: CY Limassol
- Assignee: CUPTRONIC TECHNOLOGY LTD.
- Current Assignee: CUPTRONIC TECHNOLOGY LTD.
- Current Assignee Address: CY Limassol
- Agency: Porter Wright Morris & Arthur LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7bb1ae98
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/20 ; C23C18/30

Abstract:
A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
Public/Granted literature
- US20170044670A1 METALIZATION OF SURFACES Public/Granted day:2017-02-16
Information query
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