A device and method are provided for testing the effectiveness of an adhesive composition to adhere a sheet of material to a substrate. A connector is attached to the sheet and the adhesive is used to adhere the sheet to the substrate and permitted to cure to a selected amount. After (or even before, if desired) the adhesive cures, a load is applied to the connector, having the effect of pulling the sheet away from the substrate. The duration of the pulling and the amount of the load can be varied. If too large a dome is formed under the location of the connector, the adhesive does not pass the test. Optionally, the adhesive formulation is adjusted to make it stronger to resist such doming.