Invention Grant
- Patent Title: Method for manufacturing layered scintillator panel
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Application No.: US16082492Application Date: 2016-10-21
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Publication No.: US10775518B2Publication Date: 2020-09-15
- Inventor: Tadashi Arimoto , Kei Isoda
- Applicant: KONICA MINOLTA INC.
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta, Inc.
- Current Assignee: Konica Minolta, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6a639c36
- International Application: PCT/JP2016/081222 WO 20161021
- International Announcement: WO2017/154261 WO 20170914
- Main IPC: G01T1/20
- IPC: G01T1/20 ; G01T7/00 ; G21K4/00

Abstract:
Provided is a method of manufacturing a lattice-shaped laminated scintillator panel capable of enlarging the area and increasing the thickness with a means completely different from a conventional technique using a silicon wafer.A method of manufacturing a laminated scintillator panel having a structure in which a scintillator layer and a non-scintillator layer are repeatedly laminated in a direction substantially parallel to the direction of radiation incidence, the method including: a step of forming a laminate by repeatedly laminating the scintillator layer and the non-scintillator layer; and a joining step of pressurizing the laminate to join the scintillator layer and the non-scintillator layer integrally.
Public/Granted literature
- US20190086560A1 Method for Manufacturing Layered Scintillator Panel Public/Granted day:2019-03-21
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