Invention Grant
- Patent Title: Electromagnetic activated mirror array with fluid damping and micro-fabricated recess for magnet assembly
-
Application No.: US16057198Application Date: 2018-08-07
-
Publication No.: US10775608B2Publication Date: 2020-09-15
- Inventor: Francis Man
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Conley Rose, P.C.
- Main IPC: G02B26/08
- IPC: G02B26/08 ; G02B26/10 ; B81B7/00
Abstract:
A MEMS package includes a cavity formed within a package body, a semiconductor device disposed within the cavity and including a microelectromechanical systems (MEMS) micro-mirror, a damping fluid disposed within the cavity and at least partially surrounding a portion of the MEMS micro-mirror, and a magnet assembly disposed within the cavity and at least partially surrounded by the damping fluid, the magnet assembly being magnetically coupled with the MEMS micro-mirror.
Public/Granted literature
Information query
