Systems and methods for self-determining optical inspection of wire bonds of semiconductor components. The method is an automated optical wire bond inspection method that may include obtaining an image of a semiconductor component having wire bonds. The method may also include detecting a plurality of wire bonds on the semiconductor component image so that a wire between at least two of the plurality of detected wire bonds may be detected. Further, the method may include determining an inspection region of interest corresponding to at least one detected wire bond and at least one detected wire. The method may then include inspecting the detected wire bond along the region of interest.