Invention Grant
- Patent Title: Circuit assembly
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Application No.: US16615842Application Date: 2018-05-09
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Publication No.: US10777346B2Publication Date: 2020-09-15
- Inventor: Toshiyuki Tsuchida , Shigeki Yamane
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Agency: Honigman LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f02dda8
- International Application: PCT/JP2018/017879 WO 20180509
- International Announcement: WO2018/216465 WO 20181129
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01F27/06 ; H01F27/24 ; H01F27/28 ; H05K1/11 ; H05K1/02

Abstract:
A circuit assembly includes: a circuit board; an inductor that is disposed on the circuit board, and that includes a coil including a winding portion made by winding a winding wire, and a core member; and a heat dissipation plate that is disposed on the opposite side of the surface of the circuit board on which the inductor is disposed, wherein a through hole is provided in a region of the circuit board that corresponds to the inductor, and a receiving protrusion that penetrates the through hole and protrudes to a surface side of the circuit board on which the inductor is disposed, and that is in heat transfer contact with the coil and the core member is provided in a region that corresponds to the through hole in the heat dissipation plate.
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