Invention Grant
- Patent Title: Plasma processing apparatus and plasma processing method
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Application No.: US15456894Application Date: 2017-03-13
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Publication No.: US10777389B2Publication Date: 2020-09-15
- Inventor: Taro Ikeda
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMIED
- Current Assignee: TOKYO ELECTRON LIMIED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ccc38cd
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
There is provided a plasma processing apparatus including a microwave output part configured to generate microwaves and to distribute and output the microwaves to a plurality of paths, a microwave transmission part configured to transmit the microwaves outputted from the microwave output part into a process container via a plurality of transmission paths, and a control part configured to control the microwaves. The control part is configured to control the microwaves such that the phases of microwaves become different from each other when the microwaves transmitted via the transmission paths are introduced from a microwave transmitting plate for common use into the process container.
Public/Granted literature
- US20170263417A1 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Public/Granted day:2017-09-14
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