Invention Grant
- Patent Title: Wafer arrangement and method for processing a wafer
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Application No.: US15951213Application Date: 2018-04-12
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Publication No.: US10777444B2Publication Date: 2020-09-15
- Inventor: Francisco Javier Santos Rodriguez , Gerald Lackner , Josef Unterweger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: B65D85/02
- IPC: B65D85/02 ; H01L21/683 ; H01L21/304 ; H01L21/673
Abstract:
A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably coupled to one another so that the wafer support ring can be uncoupled from the wafer without causing damage to the wafer or the wafer support ring.
Public/Granted literature
- US20180261487A1 WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER Public/Granted day:2018-09-13
Information query
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