Invention Grant
- Patent Title: Semiconductor package device for power device
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Application No.: US15649543Application Date: 2017-07-13
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Publication No.: US10777478B2Publication Date: 2020-09-15
- Inventor: Bernd Karl Appelt , Kay Stefan Essig
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L21/48 ; H01L23/498 ; H01L25/065 ; H01L21/768 ; H01L23/367 ; H01L23/48 ; H01L23/14
Abstract:
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.
Public/Granted literature
- US20180019175A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-01-18
Information query
IPC分类:
