Invention Grant
- Patent Title: Heat sink plate
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Application No.: US16157110Application Date: 2018-10-11
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Publication No.: US10777484B2Publication Date: 2020-09-15
- Inventor: Il-ho Kim , Meoung-whan Cho , Young-suk Kim
- Applicant: THE GOODSYSTEM CORP.
- Applicant Address: KR Ansan-si, Gyeonggi-do
- Assignee: THE GOODSYSTEM CORP.
- Current Assignee: THE GOODSYSTEM CORP.
- Current Assignee Address: KR Ansan-si, Gyeonggi-do
- Agency: Revolution IP, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a8edf53 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4eb95495
- Main IPC: B32B15/20
- IPC: B32B15/20 ; H01L23/373 ; B32B3/26 ; B32B15/04 ; C22C9/00 ; C22C27/04 ; F28F21/08

Abstract:
A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.
Public/Granted literature
- US20190115279A1 HEAT SINK PLATE Public/Granted day:2019-04-18
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