A semiconductor device includes a semiconductor substrate, at least two first films, a bridge portion, and a conductive member. The two first films are spaced apart from each other, along a first direction which is an in-plane direction of the semiconductor substrate, and along a second direction which is in the in-plane direction of the semiconductor substrate and is perpendicular to the first direction. The bridge portion connects portions of side facing surfaces of the two first films to each other, and has a flat bottom surface. The conductive member is provided under the bottom surface of the bridge portion.