Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16377563Application Date: 2019-04-08
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Publication No.: US10777545B2Publication Date: 2020-09-15
- Inventor: Akira Yamada , Shinya Sakurai , Takashi Nakano , Yosuke Kondo , Mutsuya Motojima
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@524ebf6c
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L21/8234 ; H01L21/8222 ; H01L27/08 ; H01L21/822 ; H01L27/06 ; H01L27/04 ; H01L27/088

Abstract:
A semiconductor device configures a protection element that protects a protection target element connected between a cathode electrode and an anode electrode when a parasitic transistor configured by a cathode region, a first conductivity type well layer, and a second conductivity type well is turned on and electrical continuity is established between the cathode electrode and the anode electrode. The semiconductor device includes a plurality of body regions in one cell of the protection element, and the plurality of body regions is brought in contact with the cathode electrode.
Public/Granted literature
- US20190237457A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-08-01
Information query
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