Invention Grant
- Patent Title: Integrated circuit device and method of manufacturing the same
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Application No.: US16363050Application Date: 2019-03-25
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Publication No.: US10777553B2Publication Date: 2020-09-15
- Inventor: Jung-hyuck Choi , Hae-wang Lee , Hyoun-jee Ha , Chul-hong Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@600c2ea3
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L23/528 ; H01L29/08 ; H01L23/535 ; H01L23/522 ; H01L29/45 ; H01L21/8234 ; H01L29/66 ; H01L29/06 ; H01L21/768 ; H01L21/762 ; H01L29/417 ; H01L27/092 ; H03K19/0944

Abstract:
An integrated circuit device may include a fin-type active region extending in a first direction on a substrate; an insulating separation structure extending in a second direction that intersects the first direction on the fin-type active region; a pair of split gate lines spaced apart from each other with the insulating separation structure therebetween and extending in the second direction to be aligned with the insulating separation structure; a pair of source/drain regions located on the fin-type active region and spaced apart from each other with the insulating separation structure therebetween; and a jumper contact located over the insulating separation structure and connected between the pair of source/drain regions.
Public/Granted literature
- US20190221563A1 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-07-18
Information query
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