Invention Grant
- Patent Title: Array substrate, method for manufacturing the same and display panel
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Application No.: US15962066Application Date: 2018-04-25
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Publication No.: US10777583B2Publication Date: 2020-09-15
- Inventor: Zhidong Wang , Yun Qiu , Lianjie Qu
- Applicant: BOE Technology Group Co., Ltd. , Beijing BOE Display Technology Co., Ltd.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2174b6cf
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L23/00

Abstract:
An array substrate, a method for manufacturing the same and a display panel are provided. The array substrate comprises: a substrate; a bare chip fixed on the substrate, the bare chip comprising pins; a buffer layer and a first metallic layer disposed sequentially on the bare chip, the first metallic layer comprising outer leads in one-to-one correspondence with the pins of the bare chip, the outer leads being connected electrically to the pins corresponding thereto of the bare chip, and the outer leads being electrically insulated from each other; a thin film transistor; and a first signal wire and a first connecting wire disposed in a same layer as a gate electrode of the thin film transistor, and a second signal wire and a second connecting wire disposed in a same layer as a source electrode and a drain electrode of the thin film transistor.
Public/Granted literature
- US20190006389A1 Array substrate, method for manufacturing the same and display panel Public/Granted day:2019-01-03
Information query
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