Invention Grant
- Patent Title: Solid-state imaging element, solid-state imaging element manufacturing method, and imaging device
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Application No.: US16462334Application Date: 2017-11-09
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Publication No.: US10777594B2Publication Date: 2020-09-15
- Inventor: Shinichi Arakawa
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@45f59276
- International Application: PCT/JP2017/040359 WO 20171109
- International Announcement: WO2018/100998 WO 20180607
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/359 ; H04N5/353

Abstract:
In a global shutter system back-illuminated CMOS image sensor, optical noise is reduced to enhance image quality. A solid-state imaging element is provided that includes: a semiconductor substrate; a photoelectric conversion unit; a charge holding unit; a first penetrating light-shielding film that partitions the photoelectric conversion unit and the charge holding unit from each other; a first bypass part containing a semiconductor material on an outer front surface of the semiconductor substrate; and a control unit that controls charge transfer from the photoelectric conversion unit to the charge holding unit via the first bypass part. A front-side end portion of the first penetrating light-shielding film has, in a thickness direction of the semiconductor substrate, an approximately same length as a front-side end of the charge holding unit or has a longer length than in the front-side end of the charge holding unit in a front side direction.
Public/Granted literature
- US20190371846A1 SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT MANUFACTURING METHOD, AND IMAGING DEVICE Public/Granted day:2019-12-05
Information query
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