Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US16547461Application Date: 2019-08-21
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Publication No.: US10777643B2Publication Date: 2020-09-15
- Inventor: Kohei Miki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/66 ; H01L29/205 ; H01L29/40

Abstract:
A semiconductor device includes: a semiconductor substrate; a buffer layer provided on the semiconductor substrate; a GaN channel layer provided on the buffer layer; an AlGaN electron travel layer provided on the GaN channel layer; a GaN cap layer provided on the AlGaN electron travel layer, having a nitrogen polarity, and on which a plurality of recesses are formed; and a gate electrode, a source electrode and a drain electrode provided in each of the plurality of recesses.
Public/Granted literature
- US20190378897A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2019-12-12
Information query
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