Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US16418775Application Date: 2019-05-21
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Publication No.: US10777660B2Publication Date: 2020-09-15
- Inventor: Meng Zhao
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2c3de987
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L21/225 ; H01L21/265 ; H01L21/266 ; H01L29/10

Abstract:
The present disclosure provides semiconductor structures. An exemplary semiconductor structure includes a substrate having a first region and a second region; an isolation structure formed in the substrate in the first region; a compensation doping region formed in the substrate in the first region, locate at a side of the isolation structure adjacent to the substrate in the second region and connecting with the isolation structure; a well region formed in the substrate in the second region; a drift region formed in the substrate in the first region and enclosing the isolation structure and the compensation doping region; a gate structure formed over the substrate in a boundary region between the first region and the second region; a source region formed in the well region at one side of the gate structure; and a drain region formed in the drift region at another side of the gate structure.
Public/Granted literature
- US20190273151A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2019-09-05
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