Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16191021Application Date: 2018-11-14
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Publication No.: US10777688B2Publication Date: 2020-09-15
- Inventor: Tomohiro Hayashi
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27a29c3d
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/11568 ; H01L29/423 ; H01L29/66 ; H01L21/28 ; H01L27/1157 ; H01L29/78

Abstract:
In a split-gate MONOS memory including a FINFET, occurrence of erroneous write in an unselected cell due to electric field concentration at an upper end of a fin is prevented, and thus reliability of a semiconductor device is improved. An insulating film is formed between an upper surface of a fin and each of a control gate electrode and a memory gate electrode in a memory cell region, so that in a gate insulating film of each of a control transistor and a memory transistor, thickness of a portion on the fin is larger than thickness of a portion covering side surfaces of the fin. The insulating film having a bird's beak at its end portion is formed to round a corner of the fin.
Public/Granted literature
- US20190198681A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-06-27
Information query
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