Invention Grant
- Patent Title: Method of manufacturing patterned substrate and method of manufacturing semiconductor device using the same
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Application No.: US16020663Application Date: 2018-06-27
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Publication No.: US10777703B2Publication Date: 2020-09-15
- Inventor: Yuki Kanagawa , Kei Murakami
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68c1ae38
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/033 ; H01L33/36 ; G03F1/50 ; G03F7/20 ; G03F1/54

Abstract:
A method of manufacturing a patterned substrate includes: providing an exposure mask that includes: a plurality of inner light-shielding portions arranged in a lattice, a light-transmissive portion integrally connecting regions surrounding the plurality of inner light-shielding portions, and an outer light-shielding portion surrounding the light-transmissive portion; performing a plurality of exposures of a photoresist layer disposed on a substrate in a step-and-repeat-manner using the exposure mask, so as to form a plurality of inner projected parts corresponding to the inner light-shielding portions, the inner projected parts being aligned in a lattice as a whole; developing the photoresist layer on which the plurality of exposures have been performed; and etching the substrate using the developed photoresist layer as a mask.
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Information query
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