Invention Grant
- Patent Title: Beamforming integrated circuit with RF grounded material ring
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Application No.: US15792479Application Date: 2017-10-24
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Publication No.: US10777888B2Publication Date: 2020-09-15
- Inventor: Vipul Jain , Noyan Kinayman , Robert J. McMorrow , Kristian N. Madsen , Shamsun Nahar , Nitin Jain
- Applicant: Anokiwave, Inc.
- Applicant Address: US CA San Diego
- Assignee: ANOKIWAVE, INC.
- Current Assignee: ANOKIWAVE, INC.
- Current Assignee Address: US CA San Diego
- Agency: Nutter McClennen & Fish LLP
- Main IPC: H01Q3/36
- IPC: H01Q3/36 ; H05K1/02 ; H01L23/367 ; H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L23/58 ; H01L23/66 ; H01P3/02 ; H01P3/08 ; H01Q3/26 ; H04B7/06 ; H04L27/26

Abstract:
A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.
Public/Granted literature
- US20180115066A1 Beamforming Integrated Circuit with RF Grounded Material Ring Public/Granted day:2018-04-26
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