Invention Grant
- Patent Title: Connector and stacked substrate module
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Application No.: US16292505Application Date: 2019-03-05
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Publication No.: US10777925B2Publication Date: 2020-09-15
- Inventor: Minoru Takizawa , Kenichi Agawa
- Applicant: Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo
- Assignee: Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2b6ed259
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R12/70 ; H05K1/14

Abstract:
According to one embodiment, a connector includes an insulating material part, and a plurality of first through conductive parts surrounded with the insulating material part, penetrating the insulating material part in a first direction, and arranged in a second direction perpendicular to the first direction, wherein each of the first through conductive parts includes a single bent portion, and the first through conductive parts are bent in the same direction.
Public/Granted literature
- US20200067220A1 CONNECTOR AND STACKED SUBSTRATE MODULE Public/Granted day:2020-02-27
Information query
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