Invention Grant
- Patent Title: Secure semiconductor chip and operating method thereof
-
Application No.: US16076473Application Date: 2017-02-10
-
Publication No.: US10778679B2Publication Date: 2020-09-15
- Inventor: Hyoung Ho Ko , Byong Deok Choi
- Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
- Applicant Address: KR Seoul
- Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
- Current Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
- Current Assignee Address: KR Seoul
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@51d7088c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1c47606d
- International Application: PCT/KR2017/001491 WO 20170210
- International Announcement: WO2017/138773 WO 20170817
- Main IPC: G11C7/24
- IPC: G11C7/24 ; H04L29/06 ; G06F15/78 ; G06F21/60 ; G06F21/57 ; G06F21/55 ; G06K19/073 ; G06Q20/34 ; G06F21/74 ; G06F21/85 ; H04L9/32

Abstract:
A semiconductor chip comprises at least one data bus to transmit data processed by the semiconductor chip, an electric potential generator block packaged together with the at least one data bus to be blocked from external light by a package, the electric potential generator block to detect an event in which the package is unable to block the external light, and a switch configured to block a transmission of at least some data in the at least one data bus if the event is detected. A semiconductor chip comprises an energy harvesting element inside a package. The energy harvesting element may comprise an on-chip photodiode. A depackaging attack causes the generation of a voltage of a photodiode, and thus a change in physical state of the packaging can be detected.
Public/Granted literature
- US20190050702A1 SECURE SEMICONDUCTOR CHIP AND OPERATING METHOD THEREOF Public/Granted day:2019-02-14
Information query