Invention Grant
- Patent Title: Microphone cavity
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Application No.: US16558254Application Date: 2019-09-02
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Publication No.: US10779077B2Publication Date: 2020-09-15
- Inventor: Austin Mackey , Brandon Hicks , Donna Marie Sullivan , Christopher Ratcliffe
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R1/08 ; H04R1/40 ; H04R31/00 ; H05K1/18

Abstract:
An apparatus includes a printed wiring board (PWB) that defines an aperture. A microphone is mounted on the PWB such that the aperture provides an acoustic path to the microphone. An acoustic interface member defines a cavity that is acoustically coupled to the microphone via the aperture. A first gasket between the printed wiring board and the acoustic interface member forms an acoustic seal. A housing is included, and a second gasket is disposed between the acoustic interface member and the housing to form an acoustic seal. An acoustic chamber is defined by a sealed volume that extends from a first (bottom/inner) surface of the housing down to a junction between the microphone and the PWB. The housing defines apertures which provide an acoustic path between a region external to the housing and the acoustic chamber. The acoustic chamber and the apertures in the housing form a Helmholtz resonator.
Public/Granted literature
- US20190387309A1 Microphone Cavity Public/Granted day:2019-12-19
Information query
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