An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.