Invention Grant
- Patent Title: Circuit board, electronic component and display apparatus
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Application No.: US16329005Application Date: 2018-01-19
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Publication No.: US10779410B2Publication Date: 2020-09-15
- Inventor: Lingguo Wang , Xin Wang , Ying Liu , Yaodong Wang , Bin Fan , Binbin Liu
- Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7912206f
- International Application: PCT/CN2018/073421 WO 20180119
- International Announcement: WO2019/007034 WO 20190110
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/34 ; H05K1/02

Abstract:
The present disclosure provides a circuit board, an electrical component and a display apparatus. The circuit board includes a wiring pad which is divided into a plurality of sub-pads by bubble discharge paths, the bubble discharge paths intersect at a first point which is a geometric center of the wiring pad. By configuring bubble discharge paths with a shape of a straight line and as being intersected at the geometric center point of the wiring pad, the circuit board can discharge gas bubbles, generated when the wiring pad is soldered to a wiring terminal of other circuit board, from the geometric center point of the wiring pad to the edge thereof via the bubble discharge paths. Thus gas bubbles can be eliminated or reduced between the wiring pad and the wiring terminal when soldering, connection between the wiring pad and the wiring terminal can be more secure.
Public/Granted literature
- US20190208635A1 CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS Public/Granted day:2019-07-04
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