Invention Grant
- Patent Title: Electronic component embedded printed circuit board and method of manufacturing the same
-
Application No.: US15003400Application Date: 2016-01-21
-
Publication No.: US10779414B2Publication Date: 2020-09-15
- Inventor: Ho-Sik Park , Dong-Keun Lee , Jae-Hoon Choi , Sang-Jae Lee , Sung-Taek Lim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@21f5a5ff
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/498 ; H05K3/40 ; H01L23/538 ; H05K3/00 ; H05K3/02 ; H05K3/46 ; H05K3/18 ; H01L23/50
Abstract:
A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.
Public/Granted literature
- US20160219710A1 ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-07-28
Information query
