Invention Grant
- Patent Title: Space-efficient pressure relief mechanism for immersion cooling of computing elements
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Application No.: US16593624Application Date: 2019-10-04
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Publication No.: US10779436B2Publication Date: 2020-09-15
- Inventor: Shurong Tian , Todd E. Takken
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel Morris, Esq.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
Public/Granted literature
- US20200037469A1 SPACE-EFFICIENT PRESSURE RELIEF MECHANISM FOR IMMERSION COOLING OF COMPUTING ELEMENTS Public/Granted day:2020-01-30
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