Invention Grant
- Patent Title: Orthopedic implant, method, and kit
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Application No.: US15204533Application Date: 2016-07-07
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Publication No.: US10779816B2Publication Date: 2020-09-22
- Inventor: Scott Goldstein , Wes Reed
- Applicant: Medline Industries, Inc.
- Applicant Address: US IL Northfield
- Assignee: Medline Industries, Inc.
- Current Assignee: Medline Industries, Inc.
- Current Assignee Address: US IL Northfield
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: A61B17/064
- IPC: A61B17/064 ; A61B17/80 ; A61B17/00

Abstract:
Disclosed in an orthopedic implant that comprises a spacer portion having a superior portion and an inferior portion, and a staple portion. The staple portion is integral with the spacer portion and comprises a crown portion and first and second leg portions, the first and second leg portions having distal end that converge front the crown portion and that are composed of a material that has superelastic properties at body temperatures, whereby the first and second leg portions are configured to impart a compressive biasing force when the implant is installed with the legs under tension.
Public/Granted literature
- US20180008263A1 ORTHOPEDIC IMPLANT, METHOD, AND KIT Public/Granted day:2018-01-11
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