Invention Grant
- Patent Title: Ultrasound sensor and method of manufacturing thereof
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Application No.: US15324140Application Date: 2015-07-09
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Publication No.: US10780458B2Publication Date: 2020-09-22
- Inventor: Chikara Kojima
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@55b13644
- International Application: PCT/JP2015/069810 WO 20150709
- International Announcement: WO2016/006671 WO 20160114
- Main IPC: B06B1/06
- IPC: B06B1/06 ; G01S15/89 ; A61B8/00 ; H01L41/29 ; H01L41/31

Abstract:
An ultrasound sensor includes: a diaphragm; a plurality of first electrodes; a plurality of second electrodes; and a plurality of piezoelectric layers which is provided between the first electrode and the second electrode, in which, in a Z-direction, a portion in which the first electrode, the piezoelectric layer and the second electrode are overlapped is referred to as an active portion, and a range to the extent that the diaphragm is oscillatable by driving the active portion is referred to as a movable portion, when a unit including one movable portion and the active portion which is provided within the one movable portion is referred to as one ultrasound element in plan view, two or more types of ultrasound elements in which a dimension of the active portion with respect to a dimension of the movable portion is different from each other in plan view are provided.
Public/Granted literature
- US20170157647A1 ULTRASOUND SENSOR AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2017-06-08
Information query
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