A wire electrical discharge machining system includes a securing device that is placed at a cut position where a workpiece on a holding unit has been cut by wire electrical discharge machining when the wire electrical discharge machining has been performed on the workpiece held on the holding unit to reach a predetermined position before the completion of machining and that individually attracts a cut-out portion from the workpiece and a remaining portion on the workpiece at the cut position where the workpiece has been cut, thereby securing the cut-out portion to the remaining portion, and a robot is configured to individually attract both the cut-out portion and the remaining portion with the securing device.