The invention relates to a method for removing metal and/or precious metal-containing depositions from substrates. The substrate is subjected to treatment with an organo amine protectant component P and an inorganic active component A. Component P may be formed in situ by reaction with component R. Component P is an organic amine and/or organic amine hydrochloride. Component A is an inorganic compound and component R is an organic compound that can be split along the C—N bond by the component A into an organic amine. The metals in the form of organo-metallic complexes can be isolated and/or separated by means of different chemical reactions and/or biosorption.