Invention Grant
- Patent Title: Apparatus and method for thermal insulation of high-temperature pressure sensors
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Application No.: US16019832Application Date: 2018-06-27
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Publication No.: US10782200B2Publication Date: 2020-09-22
- Inventor: Orry Shamash , Alan Ludwiszewski , Clinton Percy , Boris Mandadzhiev
- Applicant: MKS Instruments, Inc.
- Applicant Address: US MA Andover
- Assignee: MKS Instruments, Inc.
- Current Assignee: MKS Instruments, Inc.
- Current Assignee Address: US MA Andover
- Agency: Burns & Levinson, LLP
- Agent Joseph M. Maraia; Steven M. Mills
- Main IPC: G01L19/06
- IPC: G01L19/06 ; G01L19/14 ; C04B111/28

Abstract:
A high-temperature pressure sensor includes a pressure sensor device and a heater shell body external to the pressure sensor device for providing heat to the pressure sensor device. A particle-generating insulation material is encapsulated within an encapsulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material substantially contains particles generated by the particle-generating insulation material within encapsulated insulation structure. The encapsulated insulation structure is disposed adjacent to an exterior of the heater shell body.
Public/Granted literature
- US20200003650A1 Apparatus and Method for Thermal Insulation of High-Temperature Pressure Sensors Public/Granted day:2020-01-02
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