A photoacoustic sensor device may include a housing and first and second ceramic cavity packages disposed in the housing. The first ceramic cavity package may include a first sidewall having a first set of electrical contact elements, a first cavity structure, and a light source electrically coupled to the first set of electrical contact elements. The second ceramic cavity package may include a second sidewall having a second set of electrical contact elements, a second cavity structure, and a photoacoustic detector electrically coupled to the second set of electrical contact elements. The first and second ceramic cavity packages may be arranged such that the light source and the photoacoustic detector face one another, and oriented such that the first and second sets of electrical contact elements align with electrical contact points of a PCB when the photoacoustic sensor device is positioned over the PCB for coupling to the PCB.