A chuck apparatus includes a nozzle with a first end configured to engage a device under test (DUT), and a clamp extending around a portion of the nozzle proximate the first end. The clamp includes a recess to receive the DUT, and an engagement surface in the recess to engage the DUT. The chuck apparatus also includes a spring that biases a surface of the clamp toward the first end of the nozzle. A method includes translating a chuck to engage a nozzle with a DUT, further translating the chuck to engage and self-align an engagement surface of a spring mounted clamp with the DUT, further translating the chuck to seat the DUT in the spring mounted clamp, translating the chuck with the DUT to a contactor and translating the chuck with the DUT to engage conductive features of the DUT with conductive probes of the contactor.