Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US16048437Application Date: 2018-07-30
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Publication No.: US10784126B2Publication Date: 2020-09-22
- Inventor: Taiki Hinode , Sadamu Fujii
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d2e0a6f
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02

Abstract:
A substrate processing method includes a substrate holding step of holding a substrate horizontally, a hydrophobic agent supplying step of supplying to an upper surface of the substrate a hydrophobic agent which is a liquid for hydrophobizing the upper surface of the substrate, a low surface-tension liquid supplying step of supplying the low surface-tension liquid to the upper surface of the substrate in order to replace the hydrophobic agent on the substrate by a low surface-tension liquid lower in surface tension than water, and a humidity adjusting step of adjusting humidity of the atmosphere in contact with a liquid film on the substrate such that the humidity of the atmosphere in contact with a liquid film on the substrate in the hydrophobic agent supplying step reaches a first humidity and the humidity of the atmosphere in contact with a liquid film on the substrate in the low surface-tension liquid supplying step reaches a second humidity which is humidity lower than the first humidity.
Public/Granted literature
- US20190067046A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-02-28
Information query
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