Invention Grant
- Patent Title: Wafer clamp and a method of clamping a wafer
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Application No.: US16583112Application Date: 2019-09-25
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Publication No.: US10784133B2Publication Date: 2020-09-22
- Inventor: Fang Wan Lu , Jui Tang Chang
- Applicant: Himax Technologies Limited
- Applicant Address: TW Tainan
- Assignee: Himax Techologies Limited
- Current Assignee: Himax Techologies Limited
- Current Assignee Address: TW Tainan
- Agency: Stout, Uxa & Buyan, LLP
- Agent Donald E. Stout
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/68 ; G01V8/14
Abstract:
A wafer clamp includes a platform with a top surface, a stopper disposed at a front end of the platform, a push rod disposed at a rear end of the platform, at least one actuator pivotally connected to the push rod, and a sensor disposed at the front end of the platform, the sensor measuring a distance between the sensor and a wafer over the sensor.
Public/Granted literature
- US20200020557A1 WAFER CLAMP AND A METHOD OF CLAMPING A WAFER Public/Granted day:2020-01-16
Information query
IPC分类:
