Invention Grant
- Patent Title: Package assembly for thin wafer shipping and method of use
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Application No.: US16588082Application Date: 2019-09-30
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Publication No.: US10784137B2Publication Date: 2020-09-22
- Inventor: Damyon L. Corbin , Charles F. Musante
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: CA Ottawa
- Assignee: ELPIS TECHNOLOGIES INC.
- Current Assignee: ELPIS TECHNOLOGIES INC.
- Current Assignee Address: CA Ottawa
- Agency: Roberts Calderon Safran & Cole, P.C.
- Agent Michael McCartney; Andrew M. Calderon
- Main IPC: H01L21/673
- IPC: H01L21/673 ; B65B5/06 ; B65B7/16 ; B65B61/20
Abstract:
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Public/Granted literature
- US20200027766A1 PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE Public/Granted day:2020-01-23
Information query
IPC分类:
